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Chip to Chip Optical Interconnects (C2OI)
Program Manager: Dr. Michael Haney
The goal of the C2OI program is to remove the chip boundary as a significant obstacle to data transport and demonstrate between-chip interconnects that have comparable performance to on-chip non-local electrical interconnects. For electrical technology, the primary limitations to implementing high-speed inter-chip interconnections are achieving high packing density, low cross talk between channels, frequency-dependent loss, and high power dissipation. Current optoelectronic technologies, which are optimized for long distance telecommunication and data communication applications, do not meet the necessary metrics (power dissipation, form factor, cost, and signal integrity) needed for interconnects between high-speed electronic chips. Ideally, the use of optical interconnects will improve inter-chip communication performance. The focus goal of the C20I program is to demonstrate optical interconnections between multiple silicon chips that will enable data communications between chips to be as seamless as data communication within a chip.