Synopsis:

DARPA is soliciting innovative research proposals in the area of NanoThermal Interfaces (NTI). The primary goal of this program is the development and demonstration of ideas based on novel materials and structures that can provide significant reductions in the thermal resistance of the interface layer (often called the TIM) between the backside of an electronic device and the next layer of the package, which might be a spreader or a heatsink (this might be based on technologies developed in the DARPA-sponsored TGP and/or MACE programs, respectively). In addition to reductions in the thermal resistance of the TIM, DARPA is interested in practical considerations, such as reliability, the ability to rework the interface, and application at modest temperatures and in conventional environments. Additionally, DARPA is interested in concepts which can provide very high thermal conduction in the direction between the device and the spreader, while allowing shear due to differential thermal expansion between the device and spreader. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail is preferred. (BAA08-42@darpa.mil) . See attached full BAA.

DARPA-BAA-08-42
Sensitive/Secure Package:no
Type: Other (Draft RFPs/RFIs, Responses to Questions, etc..)
Posted Date: May 21, 2008

nti_draft_baa_080424_final_for_posting_21may08.pdf (203.56 Kb)

Contracting Office Address:
3701 North Fairfax Drive
Arlington, Virginia 22203-1714

Primary Point of Contact:
Thomas D Kenny,
Program Manager, MTO
BAA08-42@darpa.mil
Phone: 571-218-4620
Fax: 703-248-1814