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Advanced Microsystems Technology Program (AMTP)
Program Manager: Dr. Stuart Horn
This program will explore several advanced technologies and microsystem concepts. The program comprises technologies for fabrication of complex three dimensional integrated circuits; heterogeneous integration using bonding; new materials, processes, and devices for avalanche photo detectors in the infrared range using the Geiger mode; advanced lithographic patterning; and extreme scaling in transistor type devices. This program is structured to provide a great degree of flexibility to react quickly to new technical developments, and yet will provide the stable relationship needed to incubate and transfer new technologies into future DoD systems.
3-D Circuit Integration
The specific objectives of this task are: develop technologies for dense 3-D integration, to understand how best to apply 3-D integration for DoD computing and sensing applications, to develop robust methods for integrating new sensor materials with silicon, to influence the design of future DoD systems, and to transfer technology in support of such systems.
Photon-Counting APD Technologies
The goal of this task is to further the development of a new class of photon-counting sensors for DoD communications and remote sensing applications. The bands of interest are in the infrared. The technology being implemented is avalanche photo detectors in an array format. Thus far, devices and small arrays have been demonstrated in the SWIR. Device issues, scale up and extension to MWIR are under investigation. System applications that would benefit from these devices are also under investigation.
Advanced Lithography
This task builds on previous success and expertise in extending the performance of optical lithography toward deep sub-exposure wavelength features and pitches. The objectives of this task are to: (1) develop new concepts which allow practical and cost-effective extensions of optical lithography to sub-35-nm half-pitch, (2) work with industry to commercialize those technologies to help U.S. industry retain leadership in deeply-scaled CMOS technologies, and (3) understand fundamental limits of lithography.
Advanced Device Technologies and Novel Concept Development
To date, the focus of this task has been on studies and on "seedling" concept development, with emphasis on investigating high performance MOS devices, such as graphene electronics, cryoCMOS, and RF CMOS.