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DARPA STTR 2004 Phase I Award Winners American Superconductor Proposal Title: Low Cost Fabrication of 2G Wires for AC Applications ABSTRACT: Second Generation (2G) High Temperature Superconducting (HTS) wires based on the YBCO coated conductor are expected to find use in many commercial and military applications not accessible to the First Generation (1G) BSCCO HTS wires. However, the use of these 2G wires in certain applications, such as synchronous generators with both superconducting rotor field windings and armature windings, requires that the conductor be engineered to minimize ac losses. The general approach to designing a low ac loss wire is to fabricate the YBCO films into narrow filaments and then to twist the resulting multi-filamentary conductors. However, a major challenge to achieving this design is developing an industrial method to fabricate the YBCO films into narrow filaments. We propose in this Phase I STTR program to evaluate a low-cost deposition process for directly depositing multi-filamentary YBCO conductors in a striated/striped architecture without a post deposition patterning step. Our proposed approach is based on a conventional graphic arts printing technique that is currently being adapted to low-cost/high throughput fabrication of complex, high value functional materials, such as ceramic films, diode displays, transistor circuits, and biochip arrays. The proposed program will focus on demonstrating the direct deposition of patterned arrays of YBCO stripes, determining the resolution of the technique, and evaluating the electrical properties of the patterned YBCO filaments. The anticipated Phase II program will focus on fabrication of continuous lengths of patterned, striated YBCO conductors that will be fabricated into low-loss ac conductors for testing in selected pertinent applications, such as a small synchronous generator. Anvik Corp. Proposal Title: Fabrication of High Electrical Mobility Transistors on Flexible Substrates for Phased Array Radar and Terahertz Antennas ABSTRACT: Compound semiconductor films are the key ingredient enabling the construction of ultrafast (>10 GHz) transistors. Materials such as Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Germanium (SiGe) and Indium Phosphide (InP) have shown great potential to enable a quantum leap in transistor performance. There are numerous commercial and military applications for such ultrafast transistors. A particularly challenging application area is for phased array radar and terahertz antenna fabrication. These devices require the construction of high frequency transistors on large (over 1 m2), flexible substrates in order to meet the demanding requirements for fast beam steering and high angular resolution for rapid target identification and tracking. In this STTR program, we propose to develop a new process technology for fabrication of high electrical mobility transistors (HEMTs) on flexible substrates. Commercial Kapton substrates with upper process temperatures of 300-450°C will be used to support low (< 500°C) temperature-deposited semiconductor films including Si, Ge, GaN, and InP. Sequential lateral solidification (SLS), an excimer laser crystallization process, will be performed in an appropriate background atmosphere to convert the as-deposited compound semiconductor films into low-defect-density microstructures, including large single-crystal regions. The resulting substrates will then be suitable for large-area patterning of HEMTs. CostVision Proposal Title: Technology, Cost and Capacity Optimization Software to Support Low-Volume Microfabrication ABSTRACT: The proposed program will extend the CostVision technology, cost, and capacity software platform to support the needs of low-volume microfabrication. In particular, we will 1) build and demonstrate the feasibility of semiconductor technology-process models for trade-off analysis, 2) develop cost and capacity allocation methods that are flexible and leverage the CAM-I capacity model, 3) integrate the software in real-time to spreadsheets for co-simulation, and design integration infrastructure for other semiconductor IT systems, and 4) design, implement and test prototypes of advanced analysis capabilities such as sensitivity, optimization, and Monte Carlo risk analysis. Our non-profit partner, ISMI, will provide support for requirements specifications, design, and software testing. Our industrial partner, IBM Microelectronics will provide input into requirements, test cases, and usability. EOSPACE, Inc. Proposal Title: Dual-Output Broadband Linearized Modulator For Analog Photonic Links ABSTRACT: Practical, low-cost, broadband, multi-octave (0-20+ GHz), high-dynamic-range, "linear" analog photonic links are needed in many DoD communications, radar, and surveillance applications. EOSPACE and University of California, San Diego are proposing to develop a practical, broadband (0-20GHz) linearized RF analog fiber-optic link, by using a broadband optical modulator design whose transfer function has greatly enhanced linearity as compared to a conventional Mach-Zehnder device. In addition, our proposed device is very practical to realize due to relaxed fabrication tolerances and thus leads to low cost high-yield manufacturability. Fortis Technologies, Inc. Proposal Title: Stress Induced Micro/Nano Caloricparticle For Improved Thermoacoustic Refrigeration ABSTRACT: Traditional refrigeration systems based on the compression and expansion of refrigerant gases are complicated and limited to large dimensions. The pumps and compressors required makes it difficult if no impossible to scale down the system to miniature sizes that would be portable. Thermoacoustic based refrigeration systems promises to provide solid state refrigeration with no moving components, and could be scaled down to levels that would make it portable. However poor thermo efficiencies have prevented the concept from being fully developed. A miniature heat pump based on thermoacoustic refrigeration principles is proposed. The proposed concept utilizes a modified fluidic medium using micro/nano caloricparticles based on active materials. This novel improved thermoacoustic refrigeration system promises to provide substantial improvements in thermo efficiency over conventional thermoacoustic designs. The device is scalable to the microlevel, providing cooling for applications of varying dimensional scales. The refrigeration concept provides true refrigeration with much larger cooling temperature ranges compared to thermoelectric devices. GPD Optoelectronics Corp. Proposal Title: Novel SiGe Devices for Cryogenic Power Electronics ABSTRACT: It is predicted that systems for power generation, power distribution and electric propulsion on ships and aerospace vehicles could be made smaller, lighter, more efficient, more versatile, and lower maintenance by operating these systems—partly or entirely—at cryogenic temperatures. We propose to demonstrate the advantages of cryogenic operation in regard to electronic components, specifically semiconductor devices (power diodes and transistors) based on the silicon-germanium (SiGe) materials system. Our choice of SiGe is based on: first, its versatility in device design through bandgap engineering and selective placement, which enables optimizing device performance at cryogenic temperatures; and, second, its high compatibility with standard semiconductor fabrication. Our technical approach comprises four parts: (1) device simulation, (2) device fabrication and characterization, (3) evaluation of the devices in power circuits, (4) iteration of this simulation-fabrication-characterization-evaluation cycle. The initial SiGe semiconductor devices we propose to develop are diodes and thyristors (also called silicon controlled rectifiers or SCRs). LightSpin Technologies, Inc. Proposal Title: Multi-GHz InP TFT ABSTRACT: This project proposes design, construction and demonstration of a new type of thin-film transistor (TFT), based on indium phosphide compound semiconductors. Models predict unity power gain and unity current gain (fT and fmax) above 10 GHz for the new TFTs in a polycrystalline form compatible with large-area deposition & patterning on flexible metal foils or polymer sheets, using low cost, large (> 1 um) feature sizes. These TFTs should eventually outperform the best high-cost, single-crystal silicon or gallium arsenide transistors at the same feature size and temperature. Linear Photonics, LLC Proposal Title: Broadband Linearized Fiber Optic Transmitter Module ABSTRACT: Communications applications have utilized the intrinsic broadband characteristics of analog fiber optic links for myriad purposes. Today’s transmitter technology of choice for these broadband applications is an InP-based electro-absorption modulator (EAM), because of its record levels of integration, size, efficiency, dynamic range and bandwidth. However, due to the lack of availability of adaptive broadband linearization technology, the performance of applications using these links has been strictly limited. Linear Photonics, L.L.C., has successfully demonstrated that the linearity performance of EAMs can be improved dramatically using electrical predistortion circuitry. In other words, combining EAMs with inherently adaptive, broadband predistortion circuitry results in robust, compact and highly-linear transmitter modules. LPL proposes to provide a solution to the problem of limited broadband performance of analog fiber optic links by building a compact, hybrid-integrated 1-18 GHz transmitter module with RF input, optical output and DC power supply interfaces. The transmitter design will target 125 to 130 dB-Hz2/3 SFDR and will be inherently adaptive over bandwidth, temperature, and an input-modulating signal envelope. This module will be further enhanced by a highly-linear EAM that is optically linearized for improved even-order performance, as well as electronic predistortion circuitry that reduces odd-order nonlinearity to achieve the target SFDR. MTech Laboratories, LLC Proposal Title: Optimized Power Conversion at Reduced Temperatures ABSTRACT: Proposed is a novel development program that will lead to an ultra-efficient cryogenic motor controller operating at temperatures above 60K. The motor controller is intended to demonstrate a significant reduction in losses, compared to its room-temperature counterparts. Cryogenic motor controllers are targeted to be used in large-scale DOD power conversion systems incorporating second generation HTS conductors In Phase I, a fully integrated motor controller demo will be designed, utilizing the latest semiconductor power devices. The demonstration unit, which can be easily scaled up to megawatt power levels, will be fabricated and tested in Phase II. MTECH is constantly expanding its extensive database of cryogenically qualified semiconductors and electronic components, which will be available to the program. Oak Ridge National Laboratory will assist MTECH in the design, integration, and test of the power systems, cryogenics, and HTS busswork, and in the power lead design. Nanosys, Inc. Proposal Title: High Performance Transistors on Flexible Substrates ABSTRACT: This Small Business Technology Transfer Research Phase I project determines the feasibility of developing a novel low temperature process technology for the formation of low resistance contacts for fabricating high performance, nanowire transistors on flexible plastic substrates. Our proposed approach is based on an innovative plasma ion immersion implantation doping and laser annealing recrystallization process. The proposal demonstrates the potential advantages of this process to provide low ion energy implantation, uniform and conformal doping profiles, junction profile control, ohmic-contact resistance and compatibility with low temperature plastic substrates with nanowire-based transistors. In Phase I, we determine the instrument design, setup and initial process parameters and evaluate the feasibility of applying this process technology to nanowire–based transistors on flexible substrates. In Phase II, the information gathered in Phase I will be used to fabricate fully optimized prototype large area, flexible nanowire-based transistor circuits. Omega Piezo Technologies Proposal Title: Solid State Heat Pumps ABSTRACT: This research involves theoretical and experimental investigations of a novel thermoelastic effect which may be used in a completely solid state heat engine. By employing piezoelectric solids in a thermoelastic system, it may be possible to engineer a composite layered material which can use electricity to produce heat flow directly, or reversibly, to use heat to generate electricity. A composite thermo-elastic/piezoelectric material has the potential to be more efficient than the best thermoelectric device. Like material has the potential to be more efficient than the best thermoelectric device. Like a thermoelectric device, a completely solid state thermoelastic device would be more compact and robust (having no sliding parts, pressure seals, etc.) than a fluid-based heat engine. The size of a thermoeleastic device may span length scales from micrometers to centimeters, with the former having layers of nanoscale thickness. Such a span would encompass applications from microcooling electronics to personal air conditioning. Phasebridge, Inc. Proposal Title: Adaptive Broadband Linearization for Analog Photonic Links ABSTRACT: An investigation of a broadband analog optical modulator linearization scheme is proposed. The scheme is based on the combination of multiple semiconductor modulator devices, driven from a common electrical input. The linearization is accomplished in the optical domain, making the approach suitable for wideband microwave applications that have frustrated previous attempts at electrical pre-distortion linearization schemes. The proposed Phase I effort will include investigations of the linearization scheme and required semiconductor modulator device structures to establish the feasibility of the approach, leading to a Phase II effort in which integrated linearized modulator devices will be produced. Phiar Corp. Proposal Title: High Performance Metal-Insulator Transistors for Flexible Electronics ABSTRACT: We propose to develop and demonstrate thin-film transistors (TFTs) capable of operation at microwave and millimeter-wave frequencies. These ultra-fast devices are based on a patented metal-insulator tunneling hot electron transistor structure. Comprising thin films of only metals and dielectrics, our TFTs require only low temperature processing and should be inherently compatible with large-area, flexible, polymer substrates. Microwave TFTs will enable a number of important defense, scientific, and commercial applications. Our two goals for the Phase I effort are to: 1) demonstrate, using simulations, the feasibility of microwave TFT performance; and 2) demonstrate experimentally the compatibility of basic metal-insulator tunneling devices with polymer substrates. The main thrust of Phase II efforts will be to build metal-insulator TFTs and demonstrate their microwave performance and compatibility with flexible polymer substrates.
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